PCB Emas Multi-Layer berkualitas tinggi

• Tipe: Papan Sirkuit kokoh
• Elektrik: FR-4
• Material: Resin epoksi kaca serat + resin Polyimide
• Api MemRetardant Properties: V0
• Rigid Mekanis: Kaku
• Material Isolasi: Resin organik
• Tidak. Model.: Multi-Layer PCB-50
• ketebalan pp: 7628(0,18mm) 2116(0,12mm) 1080(0,08mm)
• Core Base Board: 0.3mm 0.5mm 0.6mm 0.8mm 1.0mm
• pengiriman: air,laut,express(dhl tnt fedex up)
• tanggal sampel: 5 hari
• Paket Transportasi: Vacuum Packing
• Spesifikasi: UL ISO TS16949 IPC
• Merek Dagang: ZAPON
• Asal: China
• Kode HS: 85340090
• Kapasitas Produksi: 50000sqm/Month

Deskripsi Produk

ZHEJIANG ZAPON ELECTRONIC TECHNOLOGY Co., Ltd is a professional manufacture of PCB and PCBA. Which have the factory of single side PCB, double side PCB, multi-layer PCB and PCB assembly etc. We have the ability of produce for any medium and mass quantity. The machine of our factory are on work all day and all night. With Zapon as a supplier, you will have the highest quality, quickest delivery.

Item		Capabilities
Number of Layers		From 4-layer to 22- Layer
Material		FR-4, HighTg, Rogers Halogen Free
PCB Thickness	Min. thickness	0.4mm(16mil)
	Max. thickness	3.2mm(128mil)
Surface finished		Gold Plating
		Immersion Gold(Silver)
		HAL Lead Free
		Hot Air Solder Leveling(HASL)
		Entek Coating (OSP)
Solder Mask		Green, White, Black, Yellow, Red, Blue
Other printing		Gold Finger
		Carbon Print, Peelable Mask
		Solder Mask Plugged Hole
Copper thickness		1/ 2 oz (18 μ m) - 4 oz (140 μ m)
Min. Finished Hole Size		0.2mm(8mil)
Hole Size Tolerance (PTH)		+/ -0.076mm (3 mil)
Hole Size Tolerance (NPTH)		+/-0.05mm (2 mil)
Min. Line Width and Spacing		0.1mm (4 mil)
Min. Solder Mask Clearance		0.05mm (2 mil)
Min. Annular Ring		0.076mm (3mil)
Profile and V-Cut		CNC-Routing, Stamping and Beveling, V-CUT, CNC
Special Process		Micro-section, Chamfer for Gold Finger
File format		Gerber file  , CAM350, Protel, PowerPCB
E-TEST		Flying Prob  , E-test, Fixture
Other Test		Impedance  , Slice up
Warp & Twist		≤ 0.7%