• Professional Grade Double-Sided PCB Solution
  • Professional Grade Double-Sided PCB Solution
  • Professional Grade Double-Sided PCB Solution
  • Professional Grade Double-Sided PCB Solution
  • Professional Grade Double-Sided PCB Solution
  • Professional Grade Double-Sided PCB Solution
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Professional Grade Double-Sided PCB Solution

Tipe: Papan Sirkuit kokoh
Elektrik: FR-4
Material: Epoksi Kaca serat
Api MemRetardant Properties: V0
Rigid Mekanis: Kaku
Teknologi Pemrosesan: Elecirolitik foil

Hubungi Pemasok

Anggota Berlian Harga mulai 2023

Pemasok dengan izin usaha terverifikasi

Informasi dasar.

Tidak. Model.
987654213256421122
Bahan Dasar
Tembaga
Material Isolasi
Resin epoksi
Contoh
PCB
Merek
Shengyi, Kb, Nanya, Ilm
kriteria
akial ii 0.65
ukuran lubang
0,25 mm
pinggiran bevel
ya
impedansi
50/90/100 Ohm
Trace Width(Min.)
4mil
perawatan berselancar
hasl
Paket Transportasi
Vacuum Packaging
Spesifikasi
35*35mm
Merek Dagang
XMANDA
Asal
Made in China
Kode HS
8534009000
Kapasitas Produksi
50000sqm/Month

Deskripsi Produk

Professional Grade Double-Sided PCB SolutionProfessional Grade Double-Sided PCB SolutionProfessional Grade Double-Sided PCB SolutionProfessional Grade Double-Sided PCB SolutionProfessional Grade Double-Sided PCB SolutionProfessional Grade Double-Sided PCB Solution
Specifications:

Layers: 8Thickness: 0.6-1.6mm
Material: FR4 KB6160
Size: 120*65mm
Surface treatment: HASL
Line width/spacing: 5/5mil
Minimum aperture: 0.25mm
Solder mask color: photosensitive green
Finished copper thickness: 1/1 OZ
Professional Grade Double-Sided PCB Solution

 

Professional Grade Double-Sided PCB SolutionProfessional Grade Double-Sided PCB SolutionProfessional Grade Double-Sided PCB SolutionProfessional Grade Double-Sided PCB Solution
 

Professional Grade Double-Sided PCB Solution
Professional Grade Double-Sided PCB Solution
Professional Grade Double-Sided PCB Solution
Professional Grade Double-Sided PCB Solution
 
Professional Grade Double-Sided PCB Solution
Professional Grade Double-Sided PCB Solution
Professional Grade Double-Sided PCB Solution

Features:

1. The integration of the board design is very high, the thickness-to-diameter ratio exceeds 10:1, and the difficulty of electroplating of copper is high.
2. Made of TG140 material


Shenzhen XMD Circuits Co.,Ltd, previously known as Jaleny(jlypcb), was founded in 2009 and started the journey of circuit board in Shenzhen,China. Through the introduction of advanced production and testing equipment and technical exchanges with factories in the same industry and engineering colleges, XMD greatly expanded the process capacity of double-sided board and multi-layer board. In 2011, we began to explore overseas markets and export foreign orders to all parts of the world. In 2018, Jiangxi Ji'an added a new production line, mainly making batch orders.

Able to produce 50,000 sqm of PCBs monthly
One-stop solutions for clients (PCB & PCBA)
Over 12 years of Experience in PCBs
Avg Response time: ≤24 h (experienced Engineers to Serve you)
Comply with RoHS,TS16949,ISO9001 and UL certifications.
Flexibilities in Shipment Arrangement (FOB HK or Shenzhen by sea or by air, CIF via DHL,Fedex,UPS or TNT etc.)

 

A professional team, using automation, digitization to greatly improve pcb production efficiency and reduce PCB procurement costs.

High-quality Raw Material

★Traceable source of branded raw material
★Standardized procurement process
★Strict supplier selection policy

Production Equipment
★High precision processing equipment
★Efficient operation guarantees quality
★Meet various special technical processes

Intelligent System
★Intelligent audition
★Intelligent CAM
★Intelligent paneling
★Intelligent production

Strict Inspection
★100% AOI testing
★100% FQA/FQC
★Quality Control
★'Failed One Lost Ten'

 
Our Capabilities and Technology
Items 2022 2023
Layers (MP):22layer,(Sampling):32 layer (MP):32layer
Max. Board THK Sampling 4.0mm / MP :3.2mm Sampling 5.0mm / MP:3.2mm
Min. Board THK Sampling :0.4mm /MP :0.5mm Sampling: 0.3mm / MP:0.4mm
Base copper Inner layer 1/3 ~ 6OZ 1/3~8 OZ
Outer layer 1/3 ~ 6 OZ 1/3 ~ 8 OZ
Borehole diameter Min.PTH 0.2mm 0.15mm
Max. aspect ratio 10:01 12:01
HDI aspect ratio 0.8:1 1:01
Tolerances   PTH ±0.076mm ±0.05mm
  NPTH ±0.05mm ±0.03mm
Solder mask opening 0.05mm 0.03mm
Solder dam (Green) 0.076mm , (Green) 0.076mm ,
(other color) 0.1mm (other color) 0.08mm
Min. core THK. 0.1mm 0.08mm
Bow&twist ≤0.5% ≤0.5%
Routing Tol.  Sampling :±0.075mm /MP:±0.1mm Sampling:±0.075mm /MP:±0.075mm
Impedance Tol. ±10% ±8%
Min. w/s (Inner layer) 0.075 / 0.075mm 0.075 / 0.075mm
Min. w/s (Outer layer) 0.075 / 0.075mm 0.075 / 0.075mm
 (Min. BGA size) 0.2mm 0.15mm
(pitch)(Min. BGA Pitch) 0.65mm 0.5mm
(Working panel size) 600mm*700mm 600mm*700mm
Special process Split gold fingers, Counter-bore , Counter-sink, Back-Drill, POFV , Mech. Drilling Blind hole. 



 

 

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