Factory Rigid Printed Circuit Board PCB Manufacturing in Shenzhen

Rincian Produk
Kustomisasi: Tersedia
Struktur: PCB sisi ganda
Elektrik: FR-3 -> FR-3
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Minta Sampel
Anggota Berlian Harga mulai 2013

Pemasok dengan izin usaha terverifikasi

Pemasok yang Diaudit Pemasok yang Diaudit

Diaudit oleh lembaga inspeksi pihak ketiga yang independen

Tahun Pendirian
2006-09-21
Alamat
3/F, Building B3, Fuqiao No. 4, Fuhai Subdistrict, Baoan District, Shenzhen, Guangdong, ...
Area Pabrik
580 meter persegi
  • Factory Rigid Printed Circuit Board PCB Manufacturing in Shenzhen
  • Factory Rigid Printed Circuit Board PCB Manufacturing in Shenzhen
  • Factory Rigid Printed Circuit Board PCB Manufacturing in Shenzhen
  • Factory Rigid Printed Circuit Board PCB Manufacturing in Shenzhen
  • Factory Rigid Printed Circuit Board PCB Manufacturing in Shenzhen
  • Factory Rigid Printed Circuit Board PCB Manufacturing in Shenzhen
Temukan Produk Serupa

Informasi dasar

Tidak. Model.
PCB
Bahan
Kertas Fenolik
Aplikasi
Komputer
Api MemRetardant Properties
V0
Teknologi Pemrosesan
Elecirolitik foil
Proses produksi
Proses semi-zat tambahan
Bahan Dasar
fr4
Material Isolasi
Resin organik
Merek
fastline
bahan papan
fr4
yang tersedia
1 hingga 30 lapisan
ketebalan papan
1,6 mm
ketebalan tembaga
1oz
masker solder
hijau
tirai
putih
perlakuan permukaan
hasl merdeka
uji
100%
waktu tunggu
6-8 hari kerja
lebar garis min
0,075mm
Paket Transportasi
pengemasan vakum
Spesifikasi
ip kelas -2
Merek Dagang
fastline
Asal
Shenzhen, China
Kode HS
853400900
Kapasitas Produksi
20000 meter persegi/mon

Deskripsi Produk

Factory rigid printed circuit board pcb manufacturing in Shenzhen



Product Description

                                                 Fastline  PCB's aim
 
                   Customer Satisfaction is Always Our First Priority!

 
 *Quality Policy 

           *Top Quality and high efficiency

                     *Improve continuously

                             *Achieve customer's satisfaction
Factory Rigid Printed Circuit Board PCB Manufacturing in Shenzhen



*Layers: 1-22
*Base material: FR-4 CEM-1
*Thickness: 0.2-5.0mm
*Solder mask: Green, black, red, yellow, white
*Min. Line width: 0.075mm
*Min. Line space: 0.075mm
*Min. Hole diameter: 0.1mm
*Surface treatment: Immersion gold, OSP. Lead free HASL.
*Blind/buried via holes: OK
*lead time: Seven to ten days (HDI: About 30 days)
We can also make quick pcb. As customers plates copied from the PCB, PCB design, prototype production, production, processing, and other SMT one-stop service.
Single-double sides pcb delivery time: 12-24 hours
4 layer- 8 layer pcb delivery time: 48-96 hours


Technical Capabilities
 
Items Speci. Remark
Max panel size 32" x 20.5"(800mm x 520mm)  
Min trace width/ space (inner layer) 4mil/4mil(0.1mm/0.1mm)  
Min PAD (inner layer) 5 mil(0.13mm) hole ring width
Min thickness(inner layer) 4 mil(0.1mm) without copper
Inner copper thickness 1~4 oz  
Outer copper thickness 0.5~6 oz  
Finished board thickness 0.4-3.2 mm  

Board thickness tolerance control
±0.10 mm ±0.10 mm 1~4 L
±10% ±10% 6~8 L
±10% ±10% ≥10 L
Inner layer treatment brown oxidation  
Layer count Capability 1-30 LAYER  
alignment between ML ±2mil  
Min drilling 0.15 mm  
Min finished hole 0.1 mm  
Hole precision ±2 mil(±50 um)  
tolerance for Slot ±3 mil(±75 um)  
tolerance for PTH ±3 mil(±75um)  
tolerance for NPTH ±2mil(±50um)  
Max Aspect Ratio for PTH 8:1  
Hole wall copper thickness 15-50um  
Alignment of outer layers 4mil/4mil  
Min trace width/space for outer layer 4mil/4mil  
Tolerance of Etching +/-10%  
Thickness of solder mask on trace 0.4-1.2mil(10-30um)  
at trace corner ≥0.2mil(5um)  
On base material ≤+1.2mil
  Finished thickness
 
Hardness of solder mask 6H  
Alignment of solder mask film ±2mil(+/-50um)  
Min width of solder mask bridge 4mil(100um)  
Max hole with solder plug 0.5mm  
Surface finish HAL (Lead or Lead free), immersion Gold, Immersion Nickel, Electric Gold finger, Electric Gold, OSP, Immersion Silver.  
Max Nickel thickness for Gold finger 280u"(7um)  
Max gold thickness for Gold finger 30u"(0.75um)  
Nickel thickness in Immersion Gold 120u"/240u"(3um/6um)  
Gold thickness in Immersion Gold 2u"/6u"(0.05um/0.15um)  
Impedance control and its tolerance 50±10%,75±10%,100±10% 110±10%  
Trace Anti-stripped strength ≥61B/in(≥107g/mm)  
bow and twist
 
0.75%  

Products Equipment

Factory Rigid Printed Circuit Board PCB Manufacturing in Shenzhen

How to contact us


Cellphone/  :+8618028778060

Cassie Qiu
 


 


 


 

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